CXMT Starts Mass Production on Fifth-Generation DRAM Platform

Chinese memory manufacturer CXMT says its fifth-generation DRAM technology platform has entered mass production. The company disclosed the milestone at the 2026 World Manufacturing Convention in Hefei, according to Reuters reporting published September 20.

The process reduces the spacing of key features in the memory-cell area to 11.95 nanometres and uses quadruple patterning to form finer circuit structures. CXMT says the denser layout allows more memory capacity per chip and more potential dies to fit on a wafer.

CXMT also introduced two 24-gigabit LPDDR5X products manufactured on the new platform. The company says each stores 50% more data than its previous comparable products, and both are already in mass production. The two products use different package formats for portable-device designs.

That density increase is separate from memory speed. Reuters did not report transfer-rate specifications for the two new 24Gb parts, so the announcement should not be read as evidence that they are faster than CXMT’s existing LPDDR5X products. CXMT’s previously announced LPDDR5X portfolio reaches up to 10,667 Mbps, but the company had not tied that maximum rate to these new 24Gb products in the material reviewed for this story.

CXMT says it reached the tighter feature spacing through quadruple patterning and joint work with Chinese semiconductor-equipment suppliers on critical production steps. Multiple-patterning techniques can create features smaller than a single lithography exposure can resolve, but they add process steps and alignment requirements.

That makes the gross-die figure useful but incomplete. A denser design can improve the theoretical number of chips per wafer, while the economics still depend on defect density, process complexity, cycle time and final yield. CXMT did not disclose those production metrics in the reporting reviewed here.

CXMT vice president Luo Xiaodong said the company’s process capability is now on par with the most advanced mass-produced nodes in the industry. That is a notable statement from a manufacturer that is trying to compete more directly with Samsung, SK hynix and Micron, but it is CXMT’s own characterization rather than an independent process comparison.

Process-node labels and individual feature dimensions are also poor substitutes for a complete comparison. Density, power, frequency, yield, reliability and cost all matter, and competing DRAM manufacturers do not necessarily measure or label their processes in directly comparable ways. Independent analysis of shipping dies would be needed to establish how close the new platform is in practice.

The announced chips are LPDDR5X products aimed primarily at smartphones and portable electronics, so this is not a new desktop DDR5 module launch. The broader significance is manufacturing capability: a denser production platform can give CXMT more usable product options and potentially more output from a fixed wafer area if yields are competitive.

That matters to the wider PC memory market because CXMT already sells DDR5 products and modules for PCs and servers. It does not establish that fifth-generation desktop DDR5 products are shipping today, nor does it guarantee lower retail RAM prices. It does, however, add a concrete mass-production milestone to the expansion of a fourth large DRAM supplier beyond Samsung, SK hynix and Micron.